Supporting Packaging Project for Medical Endoscope Image Sensor Chips

I. Project Background

A domestic professional medical device manufacturer focuses on the R&D and manufacturing of minimally invasive disposable endoscope equipment. The previously outsourced packaged image sensor components exceed the thickness standard and cannot fit ultra-fine medical catheters. When applied in medical high and low temperature environments, the products generate prominent imaging noise and unstable signals. Additionally, the manufacturer develops numerous new iterative models with small trial production volumes per batch. Most packaging and testing suppliers feature lengthy sample development cycles, which delay the medical device registration process. Hence, the enterprise urgently demands a dedicated image sensor packaging solution featuring ultra-thin dimensions, high reliability and rapid sample prototyping.

II. Core Customer Pain Points

1. Conventional standard packaging boasts excessive thickness. The limited internal installation space of probes fails to accommodate micro-catheter structures.

2. Ordinary plastic packaging materials have a narrow temperature resistance range, easily triggering imaging drift and increased noise under medical high and low temperature conditions.

3. Frequent trial production demands for multiple models in small batches lead to long order scheduling cycles at traditional packaging and testing enterprises, restricting R&D progress.

4. No one-stop reliability testing services are available, forcing customers to engage third-party laboratories separately and driving up R&D costs.

III. Customized Solutions from Zhongshun Microelectronics

Integrated COB ultra-thin sensor packaging services are offered tailored to the special application requirements of medical endoscopes:

1. Independently developed micro ultra-thin packaging technology cuts the overall packaging thickness by 30%, fitting the narrow internal assembly space of miniature probes.

2. Medical-grade waterproof and sealing plastic packaging raw materials and layered sealing structures are adopted, enabling the products to pass wide-temperature durability aging tests ranging from -40°C to 120°C.

3. A dedicated sample production line in a Class 10,000 clean workshop is built to conduct simultaneous sample prototyping for multiple specifications, with sample delivery completed within 7 working days.

4. Full-set tests including imaging noise reduction, constant temperature and humidity testing, and waterproof sealing inspection are conducted before delivery, with complete reliability test reports provided concurrently to eliminate customers’ need for third-party testing.

IV. Implementation Outcomes

1. The comprehensive yield rate of packaged sensor chips has risen to 99%, fully complying with medical device reliability standards.

2. Stable monthly supply of packaged image sensor components supports the launch of multiple disposable endoscope products.

3. After-sales feedback related to imaging malfunctions has dropped sharply, effectively shortening customers’ new product registration and mass production cycles.

4. One-stop delivery covering packaging and testing streamlines customers’ coordination with multiple suppliers and lowers overall R&D costs.

V. Customer Testimonial

Zhongshun Microelectronics delivers robust customized packaging capabilities for medical micro-sensors. Its ultra-thin dimensions perfectly match our endoscope catheters, imaging stability under high and low temperatures meets medical standards, sample prototyping is fast, and the one-stop testing service saves us substantial hassle.