Supporting Packaging Project for MEMS Temperature and Humidity Sensors of Vehicle-Mounted Air Conditioners

I. Project Background

A local auto parts supporting enterprise mainly engages in air conditioning control systems for new energy vehicles and fuel vehicles. The previously outsourced sensor packaging components suffered from high-low temperature signal drift and insufficient seismic performance, leading to a high factory failure rate of complete vehicles. The enterprise urgently needed an integrated MEMS temperature and humidity packaging solution complying with the AEC-Q100 automotive standard, as well as suppliers capable of rapid sample production and stable mass supply.

II. Core Customer Pain Points

1. Ordinary civil-grade packaging fails to pass automotive-grade thermal shock and long-term vibration reliability tests, resulting in data deviation after vehicle installation.

2. Traditional split sensor structures occupy excessive PCB space, hindering customers' miniaturized circuit board design.

3. The delivery cycle for small and medium-batch samples is lengthy, and most packaging and testing factories are unwilling to undertake non-standard adjustment requirements.

III. Customized Solutions from Zhongshun Microelectronics

Combined with the customer's vehicle application scenarios, our company provides full-process services for integrated MEMS sensor packaging:

1. Adopt automotive-grade DFN packaging architecture, optimize the thickened pin electroplating process to enhance seismic and humidity resistance. All products pass cyclic aging tests ranging from -40℃ to 120℃ and 1,000 thermal shock cycles.

2. Integrate temperature and humidity sensing chips as a whole, reduce external components, cut down PCB layout space for customers and lower the assembly difficulty of complete equipment.

3. Rely on fully automatic packaging production lines at the Dazu plant to set up a special sample production channel, deliver samples within 7 days, and provide complete factory inspection reports simultaneously.

4. Establish a batch-balanced supply mechanism to match the production schedule of the customer's vehicle manufacturers and ensure stable supply.

IV. Implementation Results

1. The defective rate of finished packaging products is controlled below 0.3‰, and the company successfully passed the secondary supplier qualification audit of the main vehicle manufacturer.

2. Mass production of air conditioning sensor modules matching multiple new energy vehicle models has been realized with stable monthly supply.

3. Product failure feedback decreased by 60% year-on-year, significantly cutting the customer's after-sales rework costs.

4. Nearby supply from the local plant improves the timeliness of technical communication and after-sales response by 50%.

V. Customer Feedback

Zhongshun Microelectronics boasts mature automotive-grade packaging processes whose reliability fully meets vehicle application standards. The company delivers small-batch samples efficiently, and convenient local communication effectively solves our problems concerning sensor stability.