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ST VD55H1 MONO Global Shutter Camera Module , AR / VR , QR Code , Customization Services Available

ST VD55H1 MONO Global Shutter Camera Module , AR / VR , QR Code , Customization Services Available

ST VD55H1 mono global shutter camera

AR VR camera module with customization

QR code scanning camera module

Brand Name:

Chippack

Model Number:

VD55H1

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Product Details
Sensor Type:
VD55H1CCA0
Sensor Brand:
STMicroelectronics
Active Array Size:
672*804
Pixel Size:
4.6μm*4.6μm
Optical Format:
1/4''
Power:
2.8V/1.8V/1.1V
Shutter:
Global Shutter
Color:
Monochrome
Focus Mode:
Fixed Focus
Max Frame Rates:
60fps
Data Interface:
MIPI 4 Lane
Camera Size:
Supports Rapid Sample Customization
FOV:
DFOV:20°-180°(Optional Or Customized)
IR Filter:
Clear/650nm/850nm/940nm(Optional Or Customized)
Highlight:

ST VD55H1 mono global shutter camera

,

AR VR camera module with customization

,

QR code scanning camera module

Payment & Shipping Terms
Product Description

ST VD55H1 MONO Global Shutter Camera Module , AR / VR , QR Code , Customization Services Available 


1. Basic Parameters:

‑ Resolution: 672(H)×804(V), 0.54MP, SVGA+ high‑definition specification. It can capture over 500,000 spatial ranging points to achieve high‑precision 3D depth imaging.

‑ Pixel Size: 4.6μm(H)×4.6μm(V). It adopts the Charge‑Domain Pixel (CDTI) architecture with a global shutter design, balancing pixel photosensitivity and imaging stability.

‑ Optical Format: 1/4‑inch. Featuring a compact overall size, it adapts to miniaturized module designs and meets diverse framing requirements.

‑ Supply Voltage: Core voltage 1.1V, interface voltage 1.8V, analog voltage 2.8V. It can operate stably under various voltage conditions to guarantee sensor reliability.

‑ Temperature Range: Operating temperature ranges from ‑30℃ to 85℃. The wide operating temperature range enables adaptability to diverse working environments.

 

2. Technical Features:

‑ Global Shutter Technology: The global shutter design effectively eliminates motion blur and illumination artifacts while reducing power consumption for illumination.

‑ It adopts 65‑nanometer back‑illuminated stacked‑wafer technology and is equipped with a BSI back‑illuminated image array, which greatly improves photosensitivity and light utilization and effectively reduces imaging noise. Paired with a dedicated 940 nm infrared illumination system, it achieves a demodulation contrast of over 85% and effectively suppresses ambient‑light interference. It can output high‑definition, clean depth images under complex lighting conditions including low‑light and high‑light scenarios, with depth detection accuracy significantly superior to peer‑level products.

‑ Built‑in multi‑frequency operation mechanism combined with advanced depth‑extension algorithms supports adaptive parameter adjustment for multiple scenarios. It can automatically optimize imaging parameters according to ranging distance, ambient light and equipment working conditions. Meanwhile, it is compatible with mainstream hardware platforms and development protocols, facilitating equipment function iteration and secondary development.

‑ VD55H1 MONO Camera Module: Standard modules compatible with various lens configurations such as 108° to satisfy diverse customer requirements.

 

3. Application Fields:

Applied in virtual reality / augmented reality, biometric identification, drones, smart home, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.

 

4. Customization Services:

Custom modules support customized production according to customer requirements, delivering tailor‑made products to match customers’ specific needs.

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