Chongqing Zhongshun Microelectronics Co., Ltd company profile

Chongqing Zhongshun Microelectronics Co., Ltd., founded in 2018 and located in Dazu District, Chongqing, is a key science and innovation-based manufacturing enterprise cultivated by the local government. Focusing on semiconductor packaging and testing, MEMS micro-electromechanical devices, as well as optoelectronic and environmental sensors, the company integrates research and development, design, large-scale production and sales, with its core business serving three major tracks: automotive electronics, intelligent equipment and industrial Internet of Things.

1. The company specializes in customized packaging services for mainstream plastic packaging products including BGA, LGA, DFN and QFN, as well as PLCC and MEMS micro-electromechanical devices. It has built a core technical team with extensive practical industrial experience and established a nationwide market service network through branches across multiple regions. As a highly promising backbone player within Chongqing’s semiconductor industrial cluster, it focuses on customized solutions featuring high reliability, small-batch and multi-batch production, which precisely meet stringent technical requirements for vehicle-mounted and industrial scenarios, forming core competitive advantages that distinguish it from large industrial manufacturers.

2. The company delves deep into advanced packaging and sensor integration processes. Its self-developed micro-module connection technology and high-precision sensor packaging technology have been successfully applied in industrial inspection, vehicle-mounted environment perception and other scenarios, providing low-cost, high-reliability pilot test and mass production packaging channels for small and medium-sized chip design enterprises. Meanwhile, leveraging the R&D mechanism for high-tech enterprises, the company continuously shares technical practices such as process optimization and yield improvement with the industry, serving as a technical demonstration platform for the segmented semiconductor sector in Southwest China.

3. The company has successively been awarded titles including National High-tech Enterprise, National Science and Technology-based Small and Medium-sized Enterprise, and Provincial Specialized, Refined, Unique and Innovative Small and Medium-sized Enterprise. It maintains important cooperative ties with the Chinese Academy of Sciences and holds dozens of patents, trademarks and administrative licenses in total. Supported by solid technical reserves and compliant operation capabilities, it ranks among top-quality local enterprises in Chongqing’s microelectronics and sensor industries. Committed to basing its operations in Chongqing, expanding nationwide and connecting with global markets, the company aims to become a benchmark specialized, refined, unique and innovative enterprise in automotive electronic packaging & testing and MEMS sensor sectors across Southwest China. It strives to build an integrated industrial ecosystem featuring "independent R&D, intelligent manufacturing and full-range services", break certain import technical barriers in advanced packaging and industrial sensing fields, and grow into a hidden champion with core pricing power and technological leadership within its segmented tracks.

1. Custom Design of Chip Solutions

Drawing on profound accumulated semiconductor R&D technologies, we specialize in customized design services for personalized solutions of various chip products, including IC chips, MEMS micro-electromechanical chips, optoelectronic sensors, temperature and humidity sensors, etc. We adopt a one-on-one exclusive technical docking model, conduct in-depth research on customers’ actual application scenarios and product parameter requirements, and precisely match customers’ core demands.

2. Full-process Packaging and Mass Production Implementation

We have built an integrated chip packaging and production system covering R&D sampling to large-scale mass production, enabling full-process independent control and standardized delivery. Our services fully cover rapid prototype sampling and mainstream standard packaging processes such as BGA, QFN and DFN. We also support mass production and processing of various chip modules including high-definition camera modules and sensor modules. A rigorous quality control management system has been established to strictly control production and delivery schedules and standardize production procedures. We can efficiently meet customers’ diverse demands for small-batch trial production and large-volume mass production, ensuring both on-time delivery and qualified product quality.

3. Full-cycle Professional Technical Support Services

The company has assembled an experienced R&D technical team with years of deep engagement in the semiconductor industry, boasting abundant practical experience in chip development, hardware matching and mass production implementation to provide customers with exclusive full-cycle technical support services. Core services cover all-round technical assistance including precise PCB Layout routing design, customized development of production fixtures, product testing and commissioning, performance optimization and rectification. We track the entire process of project development, sampling and mass production to guarantee long-term stability and reliability of products, safeguarding the smooth implementation of customers’ projects.

4. Long-term After-sales Technical Operation and Maintenance Services

Adhering to the philosophy of "services never end upon delivery", we have established a comprehensive long-term after-sales technical operation and maintenance system to deliver sustainable and responsive after-sales guarantee services for customers. After product delivery, exclusive maintenance services are available, including rapid troubleshooting response, regular product performance retesting, production process optimization and product version iteration upgrades. Through regular after-sales follow-ups and periodic maintenance visits, we continuously improve product performance, cut customers’ production and operation costs, and ensure stable operation of customers’ production lines.

5. One-stop Value-added Supporting Services

To fully satisfy customers’ demands for long-term cooperation and scaled development, we have set up a one-stop value-added supporting service system to comprehensively empower customers’ full-chain procurement and production operations. For customers with bulk procurement needs, customized exclusive cost optimization solutions are offered to effectively reduce their procurement and production costs via process improvement, batch proportion adjustment and supply chain integration. In addition, we provide integrated supporting services including cargo import and export customs clearance, logistics and traceability, unblocking domestic and international supply channels. We deliver a full-closed-loop one-stop service spanning solution customization, product manufacturing, practical application and long-term supply, fully meeting customers’ core demands for stable long-term supply and scaled business operation.

Development History of Chongqing Zhongshun Microelectronics Co., Ltd.

I. Preparation and Foundation Laying Stage (2013-2018): Technical Pre-research and Factory Construction

The team launched pre-research on packaging processes for semiconductor ICs and MEMS sensors in 2013, accumulating in-depth expertise in image sensors and miniature plastic packaging devices. Shenzhen Zhongshun Optoelectronics was founded in 2016 to conduct differentiated module R&D and manufacturing. In 2018, Chongqing Zhongshun Microelectronics Co., Ltd. was officially registered and settled in Dazu High-tech Zone. The company built core teams for R&D and production lines, defined chip packaging and optoelectronic/temperature-humidity sensor modules as its core businesses, and completed factory production line planning as well as initial equipment procurement.

II. Mass Production and Expansion Stage (2019-2022): Capacity Ramp-up and Market Expansion

The enterprise was certified as a National High-tech Enterprise in 2020 and launched formal large-scale mass production. Its monthly output capacity surged from several thousand K to hundreds of thousands K, accompanied by a corresponding expansion of staff. The company perfected multiple packaging product lines including PLCC, BGA, LGA, DFN, QFN and MEMS.Set up a branch in Shenzhen, establish offices in Xiamen and Taiwan, and expand domestic and overseas customer channels. Meanwhile, it developed supporting sensor businesses and expanded into both industrial and consumer electronics sectors. The company increased its paid-in registered capital and optimized its equity structure.

III. Qualification and Technology Upgrade Stage (2023-2024): Scientific Research & Technology and Patent Accumulation

Standardized R&D laboratories and a full-performance reliability testing platform were established, and key cooperation was reached with the Chinese Academy of Sciences. The team continuously tackled core technologies including miniature module interconnection and image sensor packaging, acquiring more than ten patents and software copyrights in total, and independently developing MEMS energy consumption processing systems and supporting sensor temperature measurement systems. A comprehensive self-developed testing system was built to strengthen integrated chip packaging R&D capabilities, making the company a key semiconductor manufacturer in Dazu High-tech Zone.

IV. Brand Improvement and Steady Development Stage (2025-Present): Specialized, Refined, Unique & Innovative Development and Diversified In-depth Cultivation

The enterprise has been awarded titles including Provincial Specialized, Refined, Unique and Innovative Small & Medium-sized Enterprise, National Technology-based Small & Medium-sized Enterprise, and Grade A Tax Credit Enterprise. It keeps expanding automated packaging production lines and developing new packaging products for vehicle-mounted and medical dedicated sensors. The nationwide production, sales and service network has been improved, covering chip foundry services, customized module development and technical solution provision. The company also expands its talent pool for R&D, deeply engages in the domestic substitution track of microelectronic packaging, and continuously expands its influence in the regional semiconductor industry.

Chongqing Zhongshun Microelectronics Co., Ltd. is a high-tech enterprise deeply engaged in the microelectronics packaging sector. The company has established a system of five core functional departments featuring specialization, refinement and high efficiency, namely the R&D Department, Quality Department, Production Department, Material Department and Marketing Department. Its core team consists of senior technical and management professionals with over ten years of working experience in the semiconductor industry, who deliver solid talent support and core competitiveness for the enterprise’s technological iteration, quality control, efficient production and market expansion.

I. R&D Department – Core of Corporate Innovation and Engine of Technological Iteration

The R&D team boasts more than a decade of experience in semiconductor IC packaging as well as sensor R&D and design. It focuses on core fields including photoelectric sensors, temperature and humidity sensors, wireless modules and chip packaging processes. Equipped with theoretical research, technical development capabilities and mature mass production implementation experience, the team can accurately align cutting-edge industrial technology trends with customers’ personalized requirements.

II. Quality Department – Rigorous Quality Control System to Consolidate Quality Foundations

The Quality Department team oversees product quality control, standardization implementation and brand reputation building of the company. Adhering to the management philosophy of "pursuing perfection, full-process controllability and zero-defect quality", it has built a full-process and all-dimensional quality control system covering raw material incoming inspection, production processes, finished product delivery and after-sales traceability, which fully guarantees the high quality and high stability of the company’s full range of semiconductor packaging and sensor products.

III. Production Department – Efficient Lean Production to Ensure Stable Delivery

As the core executor responsible for mass production realization, capacity output and delivery guarantee, the Production Department team leverages standardized production workshops, industry-leading automated production equipment and mature packaging manufacturing processes to undertake large-scale production, process implementation, capacity coordination and delivery control of all product lines including semiconductor ICs, photoelectric sensors and temperature & humidity sensors. It serves as the critical hub linking technical R&D and market delivery.

IV. Material Department – Integrated Supply Chain Management to Support Efficient Operation

The Material Department undertakes core responsibilities in overall supply chain coordination, material management and material guarantee. Its main work covers raw material procurement, supplier management, material warehouse control, material scheduling, inventory optimization and supply chain resource integration. It provides comprehensive material support for R&D trial production, mass manufacturing and order delivery, acting as the logistical backbone for the enterprise’s smooth operation.

V. Marketing Department – In-depth Market Layout to Empower All-round Development

The Marketing Department is tasked with market expansion, brand development, customer service and channel construction. Relying on the company’s mature product portfolio and technical strengths, it delves into segmented markets such as semiconductor packaging, intelligent sensing and IoT supporting components. Its full-spectrum work includes market research, channel development, customer liaison, order negotiation, after-sales operation and maintenance, and brand promotion.