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1.53 MP RGB Global 152.9 - Degree View Shutter Camera Module VD66GY Sensor For Machine Vision

1.53 MP RGB Global 152.9 - Degree View Shutter Camera Module VD66GY Sensor For Machine Vision

1.53 MP RGB global shutter camera

VD66GY sensor for machine vision

152.9-degree view camera module

Brand Name:

Chippack

Model Number:

VD66GY

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Product Details
Sensor Type:
VD66GYCCA
Sensor Brand:
ST
Active Array Size:
1124*1364
Pixel Size:
2.61μm*2.61μm
Optical Format:
1/4 Inches
Power:
2.8V/1.8V/1.15V
Shutter:
GS
Color:
RGB
Focus Mode:
FF Or AF
Max Frame Rates:
88fps
Data Interface:
MIPI 1/2 Lane
Camera Size:
Supports Rapid Sample Customization
FOV:
DFOV:20°-180°(Optional Or Customized)
IR Filter:
Clear/650nm/850nm/940nm(Optional Or Customized)
Highlight:

1.53 MP RGB global shutter camera

,

VD66GY sensor for machine vision

,

152.9-degree view camera module

Payment & Shipping Terms
Product Description

1.53 MP RGB Global 152.9 - Degree View Shutter Camera Module VD66GY Sensor For Machine Vision


1. Basic Parameters:

‑ Resolution: 1124(H)×1364(V), 1.53MP. The maximum frame rate at full resolution reaches 88fps; it supports 121fps in the 1‑megapixel cropping mode, with multiple frame rates adapted to different imaging requirements.

‑ Pixel Size: 2.61μm(H)×2.61μm. Equipped with back‑side illuminated (BSI) architecture and Deep Trench Isolation (DTI) technology, it delivers high light‑sensing efficiency, excellent image clarity and outstanding resistance to pixel crosstalk.

‑ Optical Format: 1/4‑inch. Compact in size, it is compatible with various miniaturized lens modules.

‑ Supply Voltage: Core voltage 1.15V, interface voltage 1.8V, analog voltage 2.8V. It can operate stably under various voltage conditions to ensure sensor reliability.

‑ Temperature Range: Operating temperature ranges from ‑30℃ to 85℃. Its wide operating temperature range enables adaptation to diverse working environments.

 

2. Technical Features:

‑ Global Shutter Technology: The global‑shutter design effectively eliminates motion blur and illumination artifacts while reducing power consumption for lighting.

‑ Adopting back‑side illuminated pixel architecture combined with DTI deep trench isolation process, it achieves excellent photosensitivity for visible light and 940nm near‑infrared light. It provides a native dynamic range of 60dB, with built‑in functions including auto‑exposure, bad‑pixel correction and gain adjustment. It produces clean images with rich details under low‑light and complex‑lighting conditions.

‑ It integrates abundant image‑control functions, supporting image cropping, pixel binning and scene‑adaptive tuning. Resolution and frame rate can be flexibly switched to balance imaging efficiency and image quality for differentiated imaging requirements across multiple scenarios. The chip features a centered ultra‑compact design with a small overall footprint, which greatly reduces integration space for devices. It also delivers favorable power‑consumption performance, suiting the design requirements of various lightweight, low‑power embedded devices.

‑ VD65G4 RGB Camera Module: Standard modules compatible with different lens configurations such as 152.9° to meet diverse customer demands.

 

3. Application Fields:

Applied in virtual reality / augmented reality, biometric identification, drones, smart home, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other fields.

 

4. Customization Services:

Custom modules can be produced according to customer requirements to deliver tailor‑made products that fit customers’ specific needs.

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