Chongqing Zhongshun Microelectronics Co., Ltd Направление компании

I. Overview of the Enterprise Production Lines

Chongqing Zhongshun Microelectronics is located in Dazu High-Tech Zone, a high-tech enterprise integrating R&D, semiconductor packaging, sensor module manufacturing, and customized OEM/ODM production. The factory is equipped with Class 10,000 constant-temperature and constant-humidity dust-free clean workshops, and fully automated intelligent manufacturing production lines covering the entire processes of SMT mounting, COB chip bonding, IC packaging, camera module assembly and aging testing. It specializes in mass production of image sensors, MEMS chips and industrial camera modules, supports sample prototyping and mass order delivery, implements 2-shift 24-hour automated production, and is backed by a complete quality inspection system to ensure stable delivery.

II. Core Segmented Production Lines

1. SMT Mounting Production Line: Equipped with full sets of high-speed mounters, SPI, AOI and X-Ray inspection equipment, capable of processing micro-components and precision BGA chips with a mounting accuracy of ±0.02mm. It realizes closed-loop automation of printing, mounting, soldering and defect inspection, and supports OEM consigned mounting and ODM matching motherboard processing.

2. COB Chip Bonding Production Line: A dedicated dust-free packaging line that performs wafer die bonding, gold wire bonding and plastic packaging curing for processing CMOS image sensors and miniature bare sensor dies, serving as the core manufacturing process for self-developed ODM modules.

3. IC Packaging Production Line: Capable of packaging various chips including DFN, QFN and BGA, covering grinding, dicing, plastic packaging and electrical testing, and undertakes external OEM chip packaging and foundry services.

4. Camera Module Assembly Production Line: Compatible with industrial AHD, Raspberry Pi high-definition camera modules and more. It automatically completes focusing, FPC pressing, waterproof dispensing and power-on aging, with finished products sorted and packaged uniformly.

5. Reliability Testing Production Line: Fitted with high-low temperature, vibration and optical testing equipment. All products undergo mandatory power-on aging, with precision and durability verified in all dimensions, maintaining a stable factory yield rate of over 99.5%.

III. Workshop Supporting Facilities and Control Standards

The workshop complies with Class 10,000 dust-free standards, with a constant temperature of 22±2℃ and humidity ranging from 40% to 60%, and full-area anti-static protection. It adopts the MES production traceability system to enable full-process tracking via product barcodes. Equipment is calibrated and maintained on a regular basis in compliance with ISO9001 and IPC industrial process standards. A three-level quality inspection system is implemented, consisting of IQC incoming material inspection, IPQC in-process patrol inspection and FQC final inspection. Automatic early warnings are triggered for process abnormalities, and production records are retained for more than 12 months.

IV. Applicable OEM/ODM Services

- OEM Model: Customers provide drawings, materials and design schemes, while our factory undertakes one-stop full-line processing, and finished products are shipped under the customer’s brand.

- ODM Model: Leveraging mature self-developed sensor and camera R&D solutions, our in-house production lines complete full-process manufacturing. Customers only need to fine-tune parameters and appearances before selling under their own brands, greatly shortening the new product development cycle.

I. Business Overview

Based in Dazu High-Tech Zone, Chongqing Zhongshun Microelectronics boasts a full-fledged R&D team and fully automated production lines. The company specializes in image sensors, industrial camera modules, MEMS chips and semiconductor packaging. It offers two core cooperation models—professional OEM consignment manufacturing and customized ODM solutions—for clients in industrial equipment, medical electronics, security surveillance and smart hardware sectors, delivering one-stop services covering R&D design, sample prototyping, mass production, testing and packaging.

II. OEM Consignment Manufacturing Model

OEM stands for Original Equipment Manufacturing, under which clients provide complete product solutions. Clients independently supply full sets of documents and materials including product drawings, PCBs, chips, electronic components, appearance structures and brand logos. Our company completes all processing procedures with in-house production lines for SMT, COB bonding, IC packaging and module assembly.

Our service scope covers PCB mounting, chip packaging, module assembly, aging testing and finished product packaging. We are solely responsible for manufacturing throughout the whole process, and finished goods are printed with the client’s LOGO and brand information before delivery.

This model suits brand clients with mature product solutions but no proprietary factories who only outsource mass production. We flexibly accept orders of all batch sizes and manufacture products in strict accordance with clients’ process standards. All materials and intellectual property rights belong to clients, with full confidentiality of product solutions guaranteed.

III. Customized ODM Solution Model

ODM refers to Original Design Manufacturing. Leveraging our in-house R&D capabilities, we have mature standardized complete sets of solutions for sensors, camera modules and IC packaging. Clients do not need to develop products from scratch; they may directly select existing mature products, or put forward customized requirements for functions, dimensions and performance. Our R&D team will adjust circuits, structures and optical parameters accordingly to complete revised prototyping.

All production processes are carried out on our proprietary production lines. Clients only need to modify appearance, color schemes, software parameters and packaging before selling products under their own brands.

This model drastically cuts clients’ upfront R&D investment and shortens the time-to-market of new products. Small-batch trial production and iterative upgrades are supported, catering to startup brands, distributors and complete equipment manufacturers for rapid new product launches.

IV. Universal Supporting Advantages of the Two Models

1. Production Assurance: Class 10,000 dust-free clean workshops, 24-hour mass production via fully automatic production lines, full-process MES traceability, and stable factory yield rates.

2. Quality Control: Compliance with the ISO9001 management system, three-layer quality inspection including IQC, IPQC and FQC, and comprehensive reliability tests covering high-low temperature cycling, vibration resistance and optical performance.

3. Flexible Delivery: Support small-batch R&D prototyping orders and long-term large-batch orders with controllable delivery schedules.

4. Confidentiality Mechanism: Non-disclosure agreements signed with all clients; strict control over the leakage of drawings, samples and finished products to safeguard clients’ intellectual property rights.

I. Overview of the R&D Center

Chongqing Zhongshun Microelectronics has set up an independent R&D center equipped with professional R&D laboratories and sample pilot workshops. Relying on its in-house technical team, the center conducts in-depth research and development on image sensors, industrial camera modules, MEMS sensor chips and semiconductor packaging processes. In coordination with automated production lines, it forms a complete closed loop of "R&D design – sample verification – mass production". It provides core technical support for the company’s ODM customization and customer technical transformation, and delivers technical services such as process optimization and troubleshooting for OEM projects simultaneously.

II. Core R&D Team and Hardware Facilities

The R&D team consists of engineers specializing in multiple fields including hardware circuits, optical imaging, structural design, chip packaging, software debugging and process engineering, with responsibilities covering the full-chain product development. The laboratories are furnished with optical testers, high-low temperature test chambers, signal analyzers, precision prototyping equipment and simulation design software, enabling independent completion of circuit simulation, structural modeling, optical calibration and pre-reliability testing. A supporting small-scale pilot production line can rapidly produce prototypes, test samples and small-batch trial products to shorten the verification cycle for new products.

III. Core R&D Tasks

1. New Product Solution Development: Independently develop standardized solutions such as Raspberry Pi camera modules, medical miniature sensors and MEMS pressure/light-sensing chips to support the supply of standardized ODM products.

2. Customized Technical Development: Adjust hardware parameters, lens specifications, PCB layouts and packaging forms in accordance with customer requirements to develop exclusive customized products.

3. Process Technology Iteration: Continuously optimize production processes including SMT mounting, COB gold wire bonding, chip packaging and module assembly to improve production line yield and product stability.

4. Reliability and Performance Optimization: Conduct high-low temperature, vibration and long-term power-on aging tests to resolve technical pain points such as image noise, sensing accuracy and electrostatic protection.

5. Technical Support Services: Provide supporting technical assistance for OEM customers, including process rectification, defect analysis and drawing optimization.

IV. Synergy Advantages of the R&D Center with OEM/ODM Businesses and Production Lines

- Compatibility with ODM Business: Mature self-developed solutions can be quickly revised on demand without external third-party design, cutting customers’ R&D costs and shortening the time-to-market of new products.

- Compatibility with OEM Business: Before customers’ proprietary solutions go into production, the R&D team conducts advance drawing reviews, predicts production risks and optimizes processing procedures to guarantee mass production yield.

V. R&D Control and Technical Assurance

R&D documents, drawings and samples are managed under classified confidentiality, and non-disclosure agreements can be signed with customers. All new products undergo multiple rounds of sampling and reliability testing before mass production. The company continuously accumulates patents and process technologies. Supported by a mature R&D system, it delivers one-stop R&D and manufacturing services for industries including industrial vision, medical electronics, intelligent security and consumer hardware.