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SiP ( System ‑ in ‑ Package ) includes 2D planar SiP , stacked ‑ die SiP , 2.5D SiP and 3D SiP

Type: 2D Planar/Stacked-die/2.5D/3D SiP

Substrate Type: Organic ABF Substrates, HTCC Ceramics, LTCC Ceramics, Silicon Interposers, Glass Interposers

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5.08 MP RGB - IR Global Shutter 155 Perspective MIPI Camera Module With VD1943 Sensor

Sensor Type: VD1943CE

Sensor Brand: STMicroelectronics

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