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Camera Sensor Module

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ST Sensor

(31)

MIPI Camera Module

(32)

DVP Camera Module

(7)

AHD Camera Module

(1)

USB Camera Module

(21)

Global Shutter Camera Module

(7)

Raspberry Pi Camera Module

(1)

OEM Camera Module

(1)

Optical Lens

(1)

Image Module

(1)

Image Sensor Packaging

(1)

MEMS Sensor

(1)

SMT Testing

(6)

SIP Packaging

(6)
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Good price 3D SiP can customize differentiated 3D stacking architectures according to customer requirements online

3D SiP can customize differentiated 3D stacking architectures according to customer requirements

Type: 3D SiP

TSV: TSV On The Chip Itself

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Good price 2.5D SiP can integrate various bare dies to meet differentiated functional requirements online

2.5D SiP can integrate various bare dies to meet differentiated functional requirements

Type: 2.5D SiP

TSV: Interposer TSV

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Good price Stacked die SiP supports the integration of various types of dies such as memory and power dies online

Stacked die SiP supports the integration of various types of dies such as memory and power dies

Type: Stacked-die SiP

TSV: No TSV

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Good price The overall technical architecture of the 2D ‑ plane SiP is concise and highly implementable online

The overall technical architecture of the 2D ‑ plane SiP is concise and highly implementable

Type: 2D Planar SiP

TSV: No TSV

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Good price SiP ( System ‑ in ‑ Package ) includes 2D planar SiP , stacked ‑ die SiP , 2.5D SiP and 3D SiP online

SiP ( System ‑ in ‑ Package ) includes 2D planar SiP , stacked ‑ die SiP , 2.5D SiP and 3D SiP

Type: 2D Planar/Stacked-die/2.5D/3D SiP

Substrate Type: Organic ABF Substrates, HTCC Ceramics, LTCC Ceramics, Silicon Interposers, Glass Interposers

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Good price Customization System In Package For IoT / Automotive Electronics online

Customization System In Package For IoT / Automotive Electronics

Type: SIP Packaging

Size: Supports Rapid Sample Customization

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Chongqing Zhongshun Microelectronics Co., Ltd
Chongqing Zhongshun Microelectronics Co., Ltd. was founded in Dazu, Chongqing in 2018. It is a key science and innovation manufacturing enterprise in the local area. Its core businesses include semiconductor packaging and testing, MEMS devices, optoelectronic and environmental sensors, covering research and development, design, production and sales, and serving three major sectors: automotive electronics, intelligent equipment and industrial Internet of Things.
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