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ST VD56G3CCA MONO Global Shutter Camera Module for AR / VR

ST VD56G3CCA MONO Global Shutter Camera Module for AR / VR

AR Global Shutter Camera Module

Mono Global Shutter Camera Module

ST VD56G3CCA

Brand Name:

Chippack

Model Number:

VD56G3CCA

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Product Details
Sensor Type:
VD56G3CCA
Sensor Brand:
ST
Active Array Size:
1124*1364
Pixel Size:
2.61 Micron*2.61 Micron
Optical Format:
1/4''
Power:
Power Supply Voltage:2.8V/1.8V/1.15V
Shutter:
GS
Color:
MONO
Focus Mode:
Fixed Focus Or Auto Focus
Max Frame Rates:
88 Frames Per Second
Data Interface:
1/2 Lane MIPI Interface
Camera Size:
Supports Rapid Sample Customization
FOV:
DFOV:20°-180°(Optional Or Customized)
IR Filter:
Clear/650nm/850nm/940nm(Optional Or Customized)
Highlight:

AR Global Shutter Camera Module

,

Mono Global Shutter Camera Module

,

ST VD56G3CCA

Payment & Shipping Terms
Product Description

ST VD56G3 MONO Global Shutter Camera Module , Machine Vision , AR / VR , QR Code , Customization Services Available .

 

1. Basic Parameters:

- Resolution: 1124 (H) × 1346 (V), 1.53MP. It can accurately capture subtle details in images and deliver outstanding imaging clarity.

- Pixel Size: 2.61μm (H) × 2.61μm (V). Adopting an advanced pixel architecture, it ensures high pixel density and compact imaging size while effectively boosting the light sensitivity of individual pixels, balancing imaging precision and light sensitivity.

- Optical Format: 1/4 inch. It features high compatibility with lenses and can flexibly meet imaging requirements for various fields of view.

- Supply Voltage: The core voltage is 1.15V, the interface voltage is 1.8V, and the analog voltage is 2.8V. It operates stably under various voltage conditions to guarantee sensor reliability.

- Temperature Range: Operating temperature ranges from -30℃ to 85℃. The wide operating temperature range enables adaptation to diverse working environments.

 

2. Technical Features:

- Global Shutter Technology: The global shutter design effectively eliminates motion blur and illumination artifacts while lowering power consumption for lighting.

- Integrating four core technologies including global shutter, Back-Side Illumination (BSI), Continuous Digital Time Integration (CDTI) and 3D stacking, the sensor achieves ultra-high quantum efficiency in the visible light band as well as the 850nm and 940nm near-infrared bands. It delivers exceptional light sensitivity in low-light conditions and an excellent Modulation Transfer Function, producing sharp images with high detail restoration to meet the demands of high-precision visual inspection.

- Equipped with on-chip integrated image processing algorithms, it natively supports automatic exposure, defective pixel correction, pixel binning, image cropping, sub-sampling and other functions. Basic image quality optimization and parameter adjustment can be realized without an external image processing chip.

- VD56G3CCA Camera Module: Compatible with standard modules fitted with different lenses such as the 73° lens to satisfy diversified customer requirements.

 

3. Application Fields:

It is applied in virtual reality/augmented reality, biometric identification, unmanned aerial vehicles, smart home, IoT devices, 3D imaging, machine vision, barcode scanning, factory automation and other sectors.

 

4. Personalized Customization Service:

Custom modules can be manufactured on demand to develop tailor-made products for customers.

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