Chongqing Zhongshun Microelectronics Co., Ltd. was founded in Dazu, Chongqing in 2018. It is a key science and innovation manufacturing enterprise in the local area. Its core businesses include semiconductor packaging and testing, MEMS devices, optoelectronic and environmental sensors, covering research and development, design, production and sales, and serving three major sectors: automotive electronics, intelligent equipment and industrial Internet of Things.

We'll get back to you as soon as possible.

sip system in package Online Manufacturer

Camera Sensor Module

ST Sensor

MIPI Camera Module

DVP Camera Module

AHD Camera Module

USB Camera Module

Global Shutter Camera Module

Raspberry Pi Camera Module

OEM Camera Module

Optical Lens

Image Module

Image Sensor Packaging

MEMS Sensor

SMT Testing

SIP Packaging

SiP ( System ‑ in ‑ Package ) includes 2D planar SiP , stacked ‑ die SiP , 2.5D SiP and 3D SiP

2.5D SiP can integrate various bare dies to meet differentiated functional requirements

The overall technical architecture of the 2D ‑ plane SiP is concise and highly implementable

Stacked die SiP supports the integration of various types of dies such as memory and power dies

SiP ( System ‑ in ‑ Package ) includes 2D planar SiP , stacked ‑ die SiP , 2.5D SiP and 3D SiP

2.5D SiP can integrate various bare dies to meet differentiated functional requirements

The overall technical architecture of the 2D ‑ plane SiP is concise and highly implementable

Stacked die SiP supports the integration of various types of dies such as memory and power dies

3D SiP can customize differentiated 3D stacking architectures according to customer requirements

Customization System In Package For IoT / Automotive Electronics