system in package (39) Online Manufacturer
Type: Image Sensor Packaging
Size: Supports Rapid Sample Customization
Type: MEMS Sensor Packaging
Size: Supports Rapid Sample Customization
Type: SIP Packaging
Size: Supports Rapid Sample Customization
Type: 2D Planar/Stacked-die/2.5D/3D SiP
Substrate Type: Organic ABF Substrates, HTCC Ceramics, LTCC Ceramics, Silicon Interposers, Glass Interposers
Type: 2.5D SiP
TSV: Interposer TSV
Type: 3D SiP
TSV: TSV On The Chip Itself
Type: 2D Planar SiP
TSV: No TSV
Type: Stacked-die SiP
TSV: No TSV
Sensor Type: OV12830
Sensor Brand: OmniVision
Process: SMT Self-developed Process
Size: Supports Rapid Sample Customization
Sensor Type: VD1943CE
Sensor Brand: ST
Sensor Type: IXM166
Sensor Brand: Sony
Sensor Type: GC2755
Sensor Brand: GalaxyCore
Sensor Type: SC223A
Sensor Brand: SmartSens
Sensor Type: OV5640
Sensor Brand: OVT
Sensor Type: VD56G3CCA/VD66GYCCA/VD16GZCCA
Sensor Brand: STMicroelectronics
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